HiSilicon Kirin 990 5G

Manufacturing Process
7nm
CPU Cores
8 cores
Instruction Set
ARMv8.2-A
Memory Type
LPDDR4X (2133MHz)
GPU
Mali-G76 MP16
5G Support
1

ℹ️ Basic Information

SOC Name HiSilicon Kirin 990 5G
Brand hisilicon
Announcement Date 06 October 2019
Class Flagship
Manufacturing Process 7nm
Manufacturing TSMC

CPU Specifications

CPU Architecture 2x 2.86 GHz – Cortex-A76
2x 2.36 GHz – Cortex-A76
4x 1.95 GHz – Cortex-A55
CPU Cores 8 Core
CPU Frequency 2860MHz
Instruction Set ARMv8.2-A

🧠 Cache & NPU

Cache 8 MB
SLC 2
NPU Da Vinci Dual-core NPU

💾 Memory

Memory Type LPDDR4X
Memory Frequency 2133MHz
Memory Bus 4
Max Bandwidth 34.1 Gb/s
Max Memory Size 12

🎮 GPU

GPU Mali-G76 MP16
GPU Architecture Bifrost 3rd gen
Pipelines 16 Pipeline
Shading Units 24 Unit
Total Shaders 384 Unit
Vulkan Version Version 1.3
OpenCL Version Version 2.0

💿 Storage & Display

Max Display Resolution 3360 x 1440
Max Camera Resolution 108

🎵 Video & Audio

Video Capture 4K @60FPS
Video Playback 4K @60FPS
Video Codecs H.264, H.265, VC-1
Audio Codecs AIFF, CAF, MP3, MP4, WAV

📶 Connectivity

5G Support 1
WiFi Wifi 6
Bluetooth Bluetooth 5.0

🛰️ Navigation Systems

GPS Yes
GLONASS Yes
Beidou Yes
Galileo No
QZSS No
NAVIC No

📊 Benchmark Scores

AnTuTu 10 714,339

⚖️ Related SOC

Displayed SoCs are selected based on performance class suitability and key benchmark metrics.
MediaTek
MediaTek • 8 cores • 2023
720,423
Samsung
Samsung • 8 cores • 2024
720,015
hisilicon
HiSilicon Kirin 990 5G
hisilicon • 8 cores • 2019
714,339
Apple
Apple • 6 cores • 2018
711,467
Qualcomm
Qualcomm • 8 cores • 2022
676,837

Positive Aspects

1. Flagship CPU & Balanced Architecture

The Kirin 990 5G combines powerful Cortex-A76 cores in a split cluster architecture with efficiency Cortex-A55 cores, offering smooth overall system performance and good multi-threaded performance for 2019 flagship use cases.

2. Strong Graphics Performance

Equipped with a 16-core Mali-G76 GPU with Vulkan 1.3 and OpenCL 2.0 support, the chipset provides solid graphics capabilities suitable for gaming and multimedia playback at high resolutions.

3. Integrated 5G & Modern Connectivity

Kirin 990 5G integrates the Balong 5000 5G modem, offering extensive 5G capability alongside Wi-Fi 6 and Bluetooth 5.0 support, making it competitive among flagship devices of its time.

Negative Aspects

1. Older Process Node

Built on a 7 nm+ process, Kirin 990 5G is less power efficient compared to newer 5 nm and 4 nm-class SoCs, which can result in higher power consumption under heavy workloads.

2. Mid-Tier AI Capability by Modern Standards

The integrated Da Vinci dual-core NPU, while advanced for its time, does not match the AI performance of later flagship NPUs from competitors, limiting its capabilities in AI-intensive tasks.

Device information for this processor will be available soon. We are working on collecting data about smartphones and tablets that use the HiSilicon Kirin 990 5G.